标准摘要
[中文适用范围]： 本部分IEC 62137描述的测试方法适用于具有薄而宽基面的表面贴装元件，如QFP和BGA。该测试方法通过循环弯曲基板来评估元件引脚与基板上焊盘之间焊点的耐久性。该测试还评估了重复机械应力（如手机按键按压）对元件端子与基板上焊盘之间焊点强度的影响。在该测试方法中，评估要求首先通过回流焊将表面贴装元件安装在基板上，然后循环弯曲基板至一定深度，直至焊点断裂。焊点的特性（例如焊料合金、基板、组装器件或设计等）被评估，以帮助提高焊点的强度。 [外文原描述]： The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.
英文名称Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test