标准摘要
This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment.
英文名称Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN