标准摘要
[中文适用范围]： IEC 62137的这一部分描述了对各种形状和类型的表面贴装器件（SMD）@阵列型器件和引线器件@以及使用各种类型的引线插入型器件进行可靠性测试的适当测试方法的选择方法。焊料材料合金。 [外文原描述]： IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following: - no technical changes; - some editorial changes and corrections; - for the sake of convenience some constitutive changes.
英文名称Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints