标准摘要
[中文适用范围]： IEC 62137的这一部分规定了安装在印刷线路板上的面阵型封装焊点的测试方法，以评估焊点对热机械应力的耐久性。 IEC 62137的这一部分适用于具有区域阵列型封装（FBGA@BGA@FLGA和LGA）的表面安装半导体器件，包括旨在用于工业和消费电气或电子设备的外围端接型封装（SON和QFN） 。附件 A 描述了由于安装时的热应力引起的温度循环测试导致封装焊点退化的加速因子。附件 H 提供了有关安装时各种类型的机械应力的一些解释。本标准中规定的测试方法并非旨在评估半导体器件本身。注1：安装条件@印刷线路板@焊接材料@等对本标准规定的试验结果有显着影响。因此，本标准中规定的测试不被视为用于保证封装安装可靠性的测试。注 2：如果在现场使用和安装后处理中焊点不存在应力（机械或其他），则不需要该测试方法。 [外文原描述]： IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. IEC 62137-4 includes the following significant technical changes with respect to IEC 62137:2004: - test conditions for use of lead-free solder are included; - test conditions for lead-free solders are added; - accelerations of the temperature cycling test for solder joints are added.
英文名称Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices