标准摘要
[中文适用范围]： IEC 62148 的这一部分涵盖了光子芯片级封装。本文件的目的是充分规定光发射器和接收器的物理要求，以实现发射器和接收器的机械互换性。 [外文原描述]： IEC 62148-19: 2019 covers the photonic chip scale package. The purpose of this document is to specify adequately the physical requirements of optical transmitters and receivers that will enable mechanical interchangeability of transmitters and receivers. Keywords: physical interface for photonic chip scale packages
英文名称Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package