标准摘要
[中文适用范围]： IEC 62148 的这一部分涵盖了使用硅细间距球栅阵列 (S-FBGA) 和硅细间距焊盘栅格阵列 (S-FLGA) 的光子集成电路 (PIC) 封装的电气接口设计指南。在本文档中，S-FBGA 封装的电气接口提供了丰富的信息。本文件的目的是充分规定由光发射器和接收器组成的 PIC 封装的电气接口，以实现 PIC 封装的机械和电气互换性 [外文原描述]： IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. Keywords: electrical interface of photonic integrated circuit (PIC) packages
英文名称Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)