标准摘要
[中文适用范围]： IEC 62148-21:2021 RLV 包含官方 IEC 国际标准及其红线版本。 Redline 版本仅提供英文版本，为您提供了一种快速、简单的方法来比较官方 IEC 标准与其先前版本之间的所有更改。 IEC 62148-21: 2021 涵盖了使用硅细间距球栅阵列 (S-FBGA) 和硅细间距焊盘栅格阵列 (S-FLGA) 的光子集成电路 (PIC) 封装的电气接口设计指南。在本文档中，S-FBGA 封装的电气接口提供了信息。本文件的目的是充分规定由光发射器和接收器组成的 PIC 封装的电气接口，以实现 PIC 封装的机械和电气互换性。第二版取消并取代了 2019 年发布的第一版。该版本构成技术修订。相对于前一版本，该版本包括以下重大技术变化：在光终端区域周围规范了电保护带区域，以允许电信号具有更高符号率（例如50Gbaud和100Gbaud）的应用。 [外文原描述]： IEC 62148-21:2021 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62148-21: 2021 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. This second edition cancels and replaces the first edition published in 2019. This edition constitutes a technical revision. This edition includes the following significant technical change with respect to the previous edition: specification of an electric guard band area around the optical terminal area, so as to allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).
英文名称Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)