标准摘要
[中文适用范围]： IEC 62258 的这一部分旨在促进半导体芯片产品的生产、供应和使用，包括 - 晶圆， - 分割的裸芯片， - 带有连接结构的芯片和晶圆， - 最低限度或部分封装的芯片和晶圆。该标准定义了描述此类模具产品所需的数据的最低要求，旨在帮助设计和采购包含模具产品的组件。它涵盖了数据要求，包括 - 产品标识， - 产品数据， - 模具机械信息， - 测试、质量、装配和可靠性信息， - 处理、运输和存储信息。该标准涵盖了描述模具的几何特性、物理特性以及在产品开发和制造中使用所需的连接方式所需的数据的具体要求。附件 A 和 B 中还分别包含术语和常用首字母缩略词列表。 [外文原描述]： This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers - singulated bare die - die and wafers with attached connection structures - minimally or partially encapsulated die and wafers This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including product identity, product data, die mechanical information, test, quality, assembly and reliability information, handling, shipping and storage information.
英文名称Semiconductor die products - Part 1: Requirements for procurement and use