标准摘要
[中文适用范围]： 本部分 IEC 62258 旨在促进半导体芯片产品的生产、供应和使用，包括：晶圆、分离的裸芯片、带有连接结构的芯片和晶圆、以及最小封装或部分封装的芯片和晶圆。该标准定义了描述此类芯片产品所需数据的最低要求，旨在作为设计和采购包含芯片产品的组件的辅助工具。它涵盖了数据要求，包括：产品身份、产品数据、芯片机械信息、测试、质量、组装和可靠性信息、以及搬运、运输和存储信息。它还涵盖了描述芯片几何特性、物理特性以及用于开发和制造产品所需连接手段的数据的具体要求。此外，该标准在附录中提供了词汇表和常用缩写列表。 [外文原描述]： IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers. This standard defines the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including: - product identity, - product data, - die mechanical information, - test, quality, assembly and reliability information, - handling, shipping and storage information. The main changes that have been introduced in this edition have been to ensure consistency across all parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be more logical and the text of some of the requirements has been amended to add requirements on further information as covered by IEC/TR 62258-4, IEC/TR 62258-7 and IEC/TR 62258-8. New requirements include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8).
英文名称Semiconductor die products - Part 1: Procurement and use