半导体压模产品.第2部分:交换数据格式

[中文适用范围]： IEC 62258-2 规定了可用于交换 IEC 62258 系列其他部分所涵盖数据的格式，以及根据 IEC 61360 的原则和方法定义的所有参数。它引入了 Device Data eXchange (DDX) 格式，其主要目标是促进芯片制造商与 CAD/CAE 用户之间传递足够的几何数据，并允许以 STEP 物理文件格式（符合 ISO 10303-21）和 XML 等格式进行数据交换的数据模型。该数据格式被故意保持灵活，以允许在此初始范围之外使用。本标准的开发旨在促进半导体芯片产品的生产、供应和使用，包括但不限于：晶圆、分选后的裸芯片、带有连接结构的芯片和晶圆、以及最小封装或部分封装的芯片和晶圆。本标准反映了 DDX 数据格式版本 1.3.0。 [外文原描述]： IEC 62258-2:2011 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0. With respect to the first edition, several parameters have been updated for this edition. This publication is to be read in conjunction with IEC 62258-1:2009 .