半导体器件上锡和锡合金精加工表面的锡晶须敏感性的环境验收要求

[中文适用范围]： 本国际标准描述了适用于锡基表面处理环境验收测试的方法以及半导体器件上锡晶须的缓解措施。该方法可能不足以满足具有特殊要求@的应用（即军事@航空航天@等）。附加要求可以在适当的要求（采购）文件中指定。本国际标准不适用于仅底部端子的半导体器件，其中整个电镀表面在组装过程中被润湿（例如：四方扁平无引线和球栅阵列元件@倒装芯片凸块端子）。遵守本标准包括满足第 6 条中所述的报告要求。 [外文原描述]： IEC 62483:2013 describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices. This methodology may not be sufficient for applications with special requirements, (i.e. military, aerospace, etc.). Additional requirements may be specified in the appropriate requirements (procurement) documentation. This first edition is based on JEDEC documents JESD201A and JESD22-A121A and replaces IEC/PAS 62483, published in 2006. This first edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) The content of IEC/PAS 62483 was added to the content of JESD201A as Annex A. b) A methodology was introduced for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers. c) A Clause 6 was introduced detailing the reporting requirements of test results.