标准摘要
[中文适用范围]： IEC 62751-2:2014+AMD1:2019+AMD2:2023给出了基于“模块化多电平换流器”的HVDC系统中阀门功率损耗的详细计算方法，其中换流器中的每个阀门由多个独立的、两端串联的可控电压源组成。它既适用于每个模块化单元在每个开关位置仅使用单个可关断半导体器件的情况，也适用于每个开关位置由多个串联的可关断半导体器件组成的情况（拓扑结构也称为“级联两电平转换器”）。给出了两级“半桥”配置的主要公式，但也给出了如何将结果扩展到某些其他类型的 MMC 构建块配置的指导。 [外文原描述]： IEC 62751-2:2014+AMD1:2019+AMD2:2023 gives the detailed method to be adopted for calculating the power losses in the valves for an HVDC system based on the "modular multi-level converter", where each valve in the converter consists of a number of self-contained, two-terminal controllable voltage sources connected in series. It is applicable both for the cases where each modular cell uses only a single turn-off semiconductor device in each switch position, and the case where each switch position consists of a number of turn-off semiconductor devices in series (topology also referred to as "cascaded two-level converter"). The main formulae are given for the two-level "half-bridge" configuration but guidance is also given as to how to extend the results to certain other types of MMC building block configuration.
英文名称Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems - Part 2: Modular multilevel converters