IEC 62769-4:2021 现行

现场设备集成(FDI).第4部分:FDI封装

标准摘要

IEC 62769-4:2021 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1.
英文名称Field Device Integration (FDI) - Part 4: FDI Packages

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