标准摘要
[中文适用范围]： 本部分IEC 62878规定了被动和主动器件嵌入式基板的测试方法。印刷线路基板材料和基板的基本测试方法在IEC 61189-3中规定。本部分IEC 62878适用于使用有机基材制造的器件嵌入式基板，包括例如主动或被动器件、电子线路板制造过程中形成的离散元件以及片状形成元件。IEC 62878系列不适用于再分布层(RDL)或IEC 62421中定义的M型商业模型的电子模块。 [外文原描述]： IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
英文名称Device embedded substrate - Part 1-1: Generic specification - Test methods