标准摘要
[中文适用范围]： 本部分 IEC 62878 规定了设备嵌入式基板的通用要求和测试方法。印刷电路板基板材料和基板本身的基本测试方法在 IEC 61189-3 中规定。 本部分 IEC 62878 适用于使用有机基材制造的设备嵌入式基板，包括例如有源或无源器件、在电子印刷板制造过程中形成的分立元件以及片状元件。 IEC 62878 系列不适用于 IEC 62421 中定义的再分布层 (RDL) 或电子模块。 [外文原描述]： IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components. The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
英文名称Device embedding assembly technology - Part 1: Generic specification for device embedded substrates