标准摘要
[中文适用范围]： IEC 62878-2-603:2025 规定了通过双向串行通信总线接口检测可堆叠电子模块在堆叠组装过程中因堆叠而引致的电气连接缺陷的电气测试方法。该方法适用于已确认为良品（KGM）的可堆叠电子模块。 [外文原描述]： IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).
英文名称Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity