标准摘要
[中文适用范围]： 本国际标准规定了机械弯曲试验，用于评估绝缘基材上印刷导电层在重复机械变形下的电性能。 [外文原描述]： IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.
英文名称Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate