标准摘要
[中文适用范围]： 本部分IEC 62899提供了一种测量柔性基材上印刷层剥离强度的测试方法。该方法要求剥离柔性基材而不是印刷层上的额外金属电镀。本文档中描述的方法可用于比较相同柔性基材和厚度条件下印刷层的剥离强度。当印刷层与柔性基材之间的粘附力弱于印刷层与粘合剂、粘合剂与面板之间的任何其他界面时，可以使用该方法。 [外文原描述]： IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.
英文名称Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method