标准摘要
[中文适用范围]： IEC 62951的本部分规定了用于柔性半导体器件的导电薄膜和柔性基板的弯曲疲劳性能的评估方法。这些膜包括沉积或粘合到非导电柔性基板上的任何膜，例如用于柔性半导体器件的薄金属膜@透明导电电极@和薄硅膜。评估基材上薄膜的电气和机械性能。疲劳试验方法包括动态弯曲疲劳试验和静态弯曲疲劳试验。 [外文原描述]： IEC 62951-4:2019 specifies an evaluation method of the bending fatigue properties of conductive thin film and flexible substrate for the application at flexible semiconductor devices. The films include any films deposited or bonded onto a non-conductive flexible substrate such as thin metal film, transparent conducting electrode, and thin silicon film used for flexible semiconductor devices. The electrical and mechanical behaviours of films on the substrate are evaluated. The fatigue test methods include dynamic bending fatigue test and static bending fatigue test.
英文名称Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices