标准摘要
[中文适用范围]： IEC 63011 的这一部分提供了与多芯片集成电路相关的定义，即使用硅通孔 (TSV) 或微凸块的垂直堆叠芯片。还提供了与多芯片集成电路的制造和测试相关的术语和定义。 [外文原描述]： IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.
英文名称Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology