封装 电路板互操作设计格式

[中文适用范围]： 本标准定义了一种通用的可互操作格式，用于设计a)大规模集成(LSI)，b)此类LSI的封装，以及c)封装LSI互连的印刷电路板。这些设计统称为LSI-封装-板(LPB)设计。该格式提供了一种通用方式来指定LPB设计中使用的项目管理、网表、组件、设计规则和几何形状的信息/数据。 [外文原描述]： IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.