标准摘要
[中文适用范围]： 本部分IEC 63215适用于分立型功率电子器件中应用的芯片连接材料和连接系统。 本文件规定了温度循环试验方法，该方法考虑了分立型功率电子器件的实际使用条件，以评估芯片连接材料和连接系统的可靠性，并建立了连接可靠性分类等级（可靠性性能指标）。 本文件规定的试验方法不适用于评估功率半导体器件本身。 本文件规定的试验方法不被视为用于保证功率半导体器件封装可靠性的方法。 注：使用本文件获得的测试结果不会作为绝对定量数据使用，而是用于与其他使用相同设置的芯片连接材料结果进行相互比较。 [外文原描述]： IEC 63215-2:2023 applies to the die attach materials and joining system applied to discrete type power electronic devices. This document specifies the temperature cycling test method which takes into account the actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system, and establishes a classification level for joining reliability (reliability performance index). The test method specified in this document is not intended to evaluate power semiconductor devices themselves. The test method specified in this document is not regarded as the one for use to guarantee the reliability of the power semiconductor device packages. NOTE The test result obtained using this document will not be used as absolute quantitative data, but for intercomparison with the other die attach materials results using the same setup.
英文名称Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices