标准摘要
[中文适用范围]： - 适用于半导体封装的3D热模拟模型的设计与分析。 [外文原描述]： IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately. This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
英文名称Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages