标准摘要
[中文适用范围]： IEC 63378-3:2025 规定了分立器件（TO-243、TO-252 和 TO-263）封装的热电路网络模型，该模型用于电子设备的瞬态分析，无需实验验证即可估算精确的结温。该模型旨在由半导体供应商制作和提供，并供电子设备组装制造商使用。 [外文原描述]： IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO‑243, TO‑252 and TO‑263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification. This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.
英文名称Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis