标准摘要
[中文适用范围]： 该PAS提供了端子间距为1毫米或更大、封装体轮廓为正方形的球栅阵列（以下简称BGA）的所有类型结构和组成材料的通用外形图和尺寸。 [外文原描述]： This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.
英文名称Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)