标准摘要
[中文适用范围]： 该标准描述了从集成电路 (IC) 芯片到球形或楔形引线键合配置中的封装引线的键合线建模。 [外文原描述]： Standardizes the first order modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers. Describes the modeling of a bond wire from an integrated circuit die to a package lead in a ball or wedge type wire bond configuration.
英文名称Bond wire modeling standard