标准摘要
[中文适用范围]： 通孔安装器件的耐焊接温度 目的 设备材料 程序 程序（续） 摘要 [外文原描述]： Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.
英文名称Resistance to soldering temperature for through-hole mounted devices