标准摘要
[中文适用范围]： 适用于半导体晶圆或芯片上与一个或多个测试结构电连接的双列和单列金属探针焊盘阵列。 [外文原描述]： Applies to double- and single-column arrays of metal probe pads, on a semiconductor wafer or chip, that are electrically connected to one or more test structures.
英文名称Guide for the standard probe pad sizes and layouts for wafer-level electrical testing