标准摘要
[中文适用范围]: 旨在确定微电子电路和设备中使用的铝和铝合金薄膜金属化的电阻温度系数(在给定的参考温度下)。该方法旨在估计由于施加的电流密度和温度应力而导致电阻率发生任何不可逆变化之前在加速电迁移应力测试中受应力的金属化线的平均温度。 [外文原描述]: Aims at determining the temperature coefficient of resistance (at a given reference temperature) of aluminium and aluminium-alloy thin-film metallization that are used in microelectronic circuits and devices. This method is intended for estimating a mean temperature of a metallization line stressed in an accelerated electromigration stress test before any irreversible change in resistivity occurs due to the current-density and temperature stresses imposed.
英文名称Standard method for measuring and using the temperature coefficient of resistance to determine the temperature of a metallization line