标准摘要
[中文适用范围]： 涵盖了用于制造主要用于电气和电子应用中的刚性或多层印刷板的基材的非织造对位芳纶增强材料的要求。确定由非织造对位芳纶纤维制成的增强材料的术语、定义、一般注释和物理要求。 [外文原描述]： Covers the requirements for nonwoven para-aramid reinforcement used in the manufacture of base materials primarily for rigid or multilayer printed boards in electrical and electronic applications. Determines the nomenclature, definitions, general comments, and physical requirements for reinforcement made from nonwoven para-aramid fibres.
英文名称Specification and characterization methods for nonwoven para-aramid reinforcement