标准摘要
[中文适用范围]： 制定了采用微孔技术的有机高密度互连层的具体要求以及采购时应满足的质量和可靠性保证要求。 [外文原描述]： Establishes the specific requirements for organic high-density interconnect layers with microvia technology as well as the quality and reliability assurance requirements that shall be met for their acquisition.
英文名称Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)