标准摘要
[中文适用范围]： 详细介绍了 IC 元件封装中使用的有机材料的湿气扩散率和水溶性等散装材料特征特性的测量程序。这两种材料特性是塑料封装 IC 在暴露于湿气和高温回流焊后有效可靠性能的重要参数。 [外文原描述]： Details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of IC components. These two material properties are important parameters for the effective reliability performance of plastic packaged ICs after exposure to moisture and subjected to high temperature solder reflow.
英文名称Test method for the measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits