标准摘要
[中文适用范围]： 本文件适用于含有无铅和含铅焊料和饰面的元件和组件。本文件描述了组件的标记及其运输容器的标签，以识别其 2na 级端子表面处理或材料，并适用于旨在通过焊接或机械夹紧或压配合连接到板或组件的组件。本文档还适用于用于直接板连接的凸块芯片的二级端子材料。本文件适用于电路板/组件，以确定所使用的无铅或含铅焊料的类型。本文档记录了一种识别电路板表面光洁度和印刷电路板 (PCB) 树脂系统的方法。本文件适用于 PCB 基材以及印刷电路板组件 (PCBA) 上使用的保形涂层类型的标记。除非供应商和客户同意，否则之前根据 JESD 97 或 IPC-1066 进行标记或贴标签的材料及其容器无需进行备注。诸如计算机、打印机、服务器等成品的外表面的标签不在本文档的范围内。然而，本文档涵盖了内部 PCB 和 PCBA。包含电子产品的零售包装的标签也不属于本文件的范围。 [外文原描述]： IEC/PAS 62588:2008(E) applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This document describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit. This document also applies to 2nd level terminal materials for bumped die that are used for direct board attach. IEC/PAS 62588:2008(E) also applies to boards/assemblies, to identify the type of Pb-free or Pb-containing solder used. This document documents a method for identifying board surface finishes and Printed Circuit Board (PCB) resin systems. This document applies to PCB base materials and for marking the type of conformal coating utilized on Printed Circuit Board Assemblies (PCBAs).
英文名称Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes