标准摘要
[中文适用范围]： 本部分IEC 60068描述了真空辅助焊接，考虑了热分析、焊接方法、组件的适用性以及焊接系统的真空特性。它基于制造商、组件、材料和焊接系统供应商的实际经验。通过提供有关真空功能以及真空对组件性能影响的信息，支持制造商。 [外文原描述]： IEC TR 60068-3-15:2024 describes vacuum-assisted soldering considering the thermal profiling, soldering methods, suitability of the components and vacuum features of soldering systems. It is based on practical experiences from manufacturers, component, material, and soldering systems suppliers. It supports manufacturers by providing information about the functionality of vacuum and effect of vacuum on components performance.
英文名称Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering