标准摘要
[中文适用范围]: 本部分IEC 61191作为技术报告,提供有关如何在电子组装行业中评估技术清洁度的信息。技术清洁度涉及电子行业中组件和电子装配体上颗粒物质(即异物碎屑)的来源、分析、减少和控制以及相关风险。 [外文原描述]: IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.
英文名称Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies