印制电路板组件第8部分:汽车电子控制装置用印制电路板组件焊点中的空隙最佳实践

[中文适用范围]： IEC 61191-8 为用于汽车电子的电子电路组装中表面贴装焊点中的空洞问题提供了指南。该技术报告专门关注连接封装电子或机电组件与印刷电路板（PB）的焊点中的空洞。不考虑其他焊点（例如，电子组件内部硅芯片与基板之间的焊点、通孔组件的焊点等）中的空洞。讨论了焊点空洞产生的技术背景、空洞对印刷电路组装可靠性和功能性的潜在影响、利用X射线检测调查样本和系列生产中的空洞水平，以及不同类型的焊点中的典型空洞水平。还给出了系列生产中控制空洞的建议。 [外文原描述]： IEC TR 61191-8:2021(E) gives guidelines for dealing with voiding in surface-mount solder joints of printed board assemblies for use in automotive electronics. This technical report focuses exclusively on voids in solder joints connecting packaged electronic or electromechanical components with printed boards (PBs). Voids in other solder joints (e.g. in a joint between a silicon die and a substrate within an electronic component, solder joints of through-hole components, etc.) are not considered. The technical background for the occurrence of voids in solder joints, the potential impact of voiding on printed board assembly reliability and functionality, the investigation of voiding levels in sample- and series-production by use of X‑ray inspection as well as typical voiding levels in different types of solder joints are discussed. Recommendations for the control of voiding in series production are also given. Annex A collects typical voiding levels of components and recommendations for acceptability.