标准摘要
[中文适用范围]: 本部分 IEC 61191 是一份技术报告,适用于电子和机电汽车电路板组件,描述了当前处理电化学反应(如迁移或腐蚀)以及电路板表面离子污染作为湿度负载下的一种失效模式的最佳实践。本文档涉及材料和制造工艺的评估,用于制造电子组件,重点关注其在湿度负载下的可靠性。设备在潮湿环境中的电气操作可能引发电化学反应,导致组件上的短路和故障。在此背景下,提到了大量术语和方法,如 CAF(导电阳极丝)、阳极迁移现象、枝晶生长、阴极迁移、ROSE(溶剂提取物的电阻率)、离子污染、SIR(表面绝缘电阻)、阻抗光谱等,这些术语和方法被不同地使用和解释。本文档的目的是实现语言的统一使用,并列出常见测量方法的可能性和限制。文档的重点是组件表面上阴极枝晶形成的电化学迁移的错误模式。控制单元在高湿度负载下的不同测试方法的评估不在本文档范围内。 [外文原描述]: IEC TR 61191-9:2023, which is a Technical Report, applies to electronic and electromechanical automotive circuit board assemblies and describes current best practices for dealing with electrochemical reactions like migration or corrosion and ionic contamination on the surface of a circuit board as one failure mode under humidity load. This document deals with the evaluation of materials and manufacturing processes for the manufacturing of electronic assemblies with focus on their reliability under humidity loads. The electrical operation of a device in a humid environment can trigger electrochemical reactions that can lead to short circuits and malfunctions on the assembly. In this context, a large number of terms and methods are mentioned, such as CAF (conductive anodic filament), anodic migration phenomena, dendrite growth, cathodic migration, ROSE (resistivity of solvent extract), ionic contamination, SIR (surface insulation resistance), impedance spectroscopy, etc., which are used and interpreted differently. The aim of the document is to achieve a uniform use of language and to list the possibilities and limitations of common measurement methods. The focus of the document is on the error pattern of electrochemical migration on the surface of assemblies with cathodic formation of dendrites. Evaluation of different test methods of control units under high humidity load are not part of this document.
英文名称Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices