标准摘要
[中文适用范围]： 本部分（IEC 61760-3）补充了 IEC 61760-3，旨在描述锡膏供料方法的示例，说明端子位置公差与通孔直径之间的关系，并提供采用锡膏表面印刷法设计印刷电路板的指南，包括具体示例。 [外文原描述]： IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.
英文名称Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method