标准摘要
[中文适用范围]： 本文档描述了使用电阻应变仪确定组装过程中关键机械应力的方法示例。这些应力可能会损坏片式陶瓷元件，导致所谓的“弯曲裂纹”。区域阵列元件不在本文档的范围内。 [外文原描述]： IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.
英文名称Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components