航空电子设备的过程管理.运行中的电子元件能力.第1部分:温度升高

[中文适用范围]： 本部分IEC 62240作为技术报告，提供了在比设备制造商规定的更宽温度范围内使用半导体器件的信息。本文描述的升级解决方案被视为例外情况，在没有合理替代方案时使用；否则应在制造商规格范围内使用器件。 术语“升级”和“热升级”在航空电子行业讨论和会议中越来越多地被使用，其明确定义见第3章。这些术语是电路设计中电子元件选择方法特殊情况的简称。 本文档描述了实施这种特殊热升级情况的方法和流程。所有这些方法和流程都采用现有的、常用的最佳工程实践。遵循这些流程不需要新的或独特的工程知识，只需严格应用整体方法。 即使器件在更宽温度范围内使用，更宽温度的使用也将限于不影响应用性能和可靠性的范围，特别是对于具有窄特征尺寸几何形状的器件（例如90纳米及以下）。本文档并不意味着应用使用器件超出原始设备制造商指定的器件的绝对最大额定限制，并假设： – 仅在无合理替代方法可用时，才在原始设备制造商规定的温度范围之外使用器件，并有适当的理由； – 如果必须在原始设备制造商规定的温度范围之外使用器件，应通过有记录和受控的流程进行，以确保电子设备的完整性。 [外文原描述]： IEC TR 62240-1:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC TR 62240-1:2018 is a technical report, which provides information when using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. The uprating solutions described herein are considered exceptions, when no reasonable alternatives are available; otherwise devices are utilized within the manufacturers’ specifications. This document describes the methods and processes for implementing this special case of thermal uprating. All of the elements of these methods and processes employ existing, commonly used best engineering practices. No new or unique engineering knowledge is needed to follow these processes, only a rigorous application of the overall approach. The terms “uprating” and “thermal uprating” are being used increasingly in avionics industry discussions and meetings, and clear definitions are included in the present IEC Technical Report. They were coined as shorthand references to a special case of methods commonly used in selecting electronic components for circuit design. This new edition cancels and replaces the first edition published in 2013 and includes a revised wording for subclause 4.1 (Introduction to selection provisions) and the associated flowchart.