半导体压模产品.第3部分:搬运、包装和储存的良好实施规程建议

[中文适用范围]： 本技术报告的制定是为了促进半导体芯片产品的生产、供应和使用，包括： - 单一化裸芯片， - 最低限度或部分封装的芯片和晶圆。本报告包含建议的良好实践 [外文原描述]： This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: - singulated bare die, - minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly.