半导体压模产品.第3部分:搬运、包装和储存的良好实施推荐规程

[中文适用范围]： 本技术报告旨在促进半导体芯片产品的生产、供应和使用，包括： – 晶圆， – 分割的裸芯片， – 带有连接结构的芯片和晶圆，以及 – 最低限度或部分封装的芯片和晶圆。本报告包含了模具产品处理、包装和储存的建议良好实践。通过关注处理、储存和环境条件，可以提高包含模具产品的电子组件制造的成功率。该报告提供了取自行业经验的指南，对于首次将模具产品集成到组件中的人员特别有用。它还旨在帮助建立和审核处理或使用裸芯片产品（从晶圆制造到最终组装）的设施。 [外文原描述]： IEC/TR 62258-3:2010 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - and minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly. This edition includes the following significant technical changes with respect to the previous edition. 1. Special requirements have been added throughout the document for optical die, where applicable. For example see 4.3 paragraph 4 and 10.1.3 paragraph 3. 2. The following new subclauses have been added: - 4.4.6 ESD Guidelines - 5.1 Wafer thinning 3. Subclause 5.2 (Singulation or die separation) has been renamed from the previous Subclause 5.1 (Wafer sawing) and has been expanded to included other methods of singulation or sawing, including: - 5.2.2 Wafer scribing - 5.2.3 Laser cutting - 5.2.4 Dice before grind (DBG) 4. Subclause 5.3.7 (previous edition Subclause 5.2.7) has been changed to include optical and microwave die. 5. In Subclause 6.3, the Subclause 6.3.2 (Specialised wafer tubs) has been added to include wafer taubs specially handle and ship wafers that have not been singulated. 6. Two new Subclauses have been to Clause 6: - 6.9 Handling and packing of thinned die or wafers - 6.10 Packing materials and their reuse 7. A new subclause has been added to Subclause 9.6: - 9.6.3 Use of packing material having sacrificial properties 8. Annex A (Planning checklist) has been updated throughout. 9. In Annex B (Material specifications) a new Subclause has been added: - B.5 Adhesive gel tray material specifications.