标准摘要
[中文适用范围]： IEC 62258 的这一部分的开发是为了促进半导体芯片产品的生产、供应和使用，包括？晶圆； ？分割裸芯片； ？带有连接结构的芯片和晶圆； ？最低限度或部分封装的芯片和晶圆。本技术报告包含一份基于 IEC 62258 其他部分要求的调查问卷，可用于芯片器件供应商和采购商之间的谈判和合同。它旨在帮助芯片器件供应链中的所有参与者遵守 IEC 62258-1 和 IEC 62258-2 标准的要求。应该认识到，本技术报告中包含的表格构成了可能提供的信息清单，并且可能不相关或不可能填写所有字段。不同的市场可能需要此处请求的信息的不同子集。 [外文原描述]： This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1 and IEC 62258-2 standards.
英文名称Semiconductor die products - Part 4: Questionnaire for die users and suppliers