标准摘要
[中文适用范围]： IEC/TR 62258-7 是一份技术报告，旨在促进半导体芯片产品的生产、供应和使用，包括： • 晶圆； • 分割裸芯片； • 带有连接结构的芯片和晶圆； • 最低限度或部分封装的芯片和晶圆。该报告包含一个 XML 模式，该模式描述了数据交换所需的元素，并将允许实现 IEC 62258-1、IEC 62258-5 和 IEC 62258-6 的要求，并提供一个补充的交换结构IEC 62258-2 中定义的那些。它也是对 IEC/TR 62258-4 中调查问卷的补充和兼容。 [外文原描述]： This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.
英文名称Semiconductor die products - Part 7: XML schema for data exchange