半导体压模产品.第8部分:数据交换用描述(EXPRESS)模型图解

[中文适用范围]： IEC62258 的这一部分是一份技术报告，旨在促进半导体芯片产品的生产、供应和使用，包括 ~ 晶圆、 ~ 分割的裸芯片、 ~ 具有附加连接结构的芯片和晶圆、 ~ 最低限度或部分封装芯片和晶圆。本技术报告包含一个 EXPRESS 模型架构，该模型描述了数据交换所需的元素，并将允许实施 IEC62258-1、IEC62258-5 和 IEC62258-6 标准的要求，并提供互补的交换结构符合 IEC 62258-2 中定义的内容。它也是对 IEC 62258-4 中调查问卷的补充和兼容。 [外文原描述]： IEC/TR 62258-8:2008(E), which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This Technical Report contains an EXPRESS model schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of the IEC 62258-1, IEC 62258-5 and IEC 62258-6 standards, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC 62258-4.