标准摘要
[中文适用范围]： IEC TR 62433-4-1:2025 提供了从测量中提取 ICIM-CI 模型以及构建用于放置 ICIM-CI 模型的印制电路板（PCB）数值模型的良好实践概述。该文件还讨论了在提取 ICIM-CI 模型以及在 PCB 层面使用实际模型时需考虑的因素，以确保获得准确的结果。 [外文原描述]： IEC TR 62433-4-1:2025 provides an overview of good practices to extract an ICIM-CI model from measurements and to build a numerical model of the PCB in which the ICIM-CI model is used to predict RF immunity of an IC in its application PCB. This document also discusses factors which can be considered to obtain proper results in an ICIM-CI model extraction and use of the actual model at the PCB level.
英文名称EMC IC modelling - Part 4-1: Use of ICIM-CI model to predict the IC conducted immunity in a PCB