标准摘要
[中文适用范围]： This Technical Report covers the roadmap of optical circuit boards, and its related packaging technologies including optical circuit board connectors and optical modules onboards. [外文原描述]： IEC/TR 62658:2013(E) covers the roadmap of optical circuit boards, and its related packaging technologies including optical circuit board connectors and optical modules on boards. Keywords: optical packaging technology road map, roadmap of optical circuit boards
英文名称Roadmap of optical circuit boards and their related packaging technologies