标准摘要
[中文适用范围]： 本技术报告详细描述了印刷线路板因电化学迁移而劣化的历史@测量方法@故障的观察以及测试备注。 [外文原描述]： IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
英文名称Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing