标准摘要
[中文适用范围]： This part of IEC 62878 describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices. [外文原描述]： IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
英文名称Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards