半导体器件.汽车故障试验方法的标准化路线图

[中文适用范围]： 本技术报告描述了用于汽车集成电路故障测试方法的标准化路线图。由于汽车暴露在非常低或高温、振动、高频信号等恶劣环境中，因此需要测试可能由恶劣环境引起的故障。有几种故障测试方法和相关问题需要标准化。 用于汽车的半导体器件暴露在非常高或非常低温、振动、高频信号等恶劣环境中。因此，它们需要测试可能由恶劣环境引起的故障。根据本故障测试方法的评估结果将提供半导体器件的鲁棒性。 [外文原描述]： IEC TR 63357:2022(E) describes standardization roadmap of fault test methods for integrated circuits used in automotive vehicles. Since automotive vehicles are exposed in harsh environment such as very low or high temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment. There are several fault test methods and related issues to be standardized. Semiconductor devices used in automotive vehicles are exposed in harsh environment of very high or very low temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment Evaluation results following this fault test methods will provide robustness of the semiconductor device.